Partial semiconductor wafer processing using wafermap display

摘要

Partial wafer processing is achieved by down loading the wafer map of the whole wafer from a host (2) and display the whole wafer in the die bonder monitor (3) move the wafer table to a first die pickup position (4) and move the display cursor to the first die pickup position (5) and teach two limit die coordinates in X direction (6) and teach two limit die coordinates in Y direction (7) and then using limit die coordinates as information remove other partial wafer die coordinates from the map (8) and select die pickup sequence (9).