LEAD FRAME, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To make adhesion of the lead frame and the heat sink easy in a method for manufacturing a lead frame with a heat sink using the lead frame wherein conductive leads and leads hanging the heat sink are formed. SOLUTION: In a lead frame having a plurality of conductive leads and the leads hanging the heat sink, it is the lead frame wherein a silver (Ag) thin film layer is formed on the area where the heat sink of the leads is hanging the heat sink.