发明名称 SURFACE ACOUSTIC WAVE DEVICE AND ITS PRODUCING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable surface acoustic wave device and its producing method, in which adhesion strength can be enhanced and stripping after bump or wire bonding jointing can be prevented as much as possible after being bonded. SOLUTION: An electrode 4 for exciting surface acoustic waves and a single- layer pad electrode 5, connected with the excitation electrode 4 and being thicker than the exciting electrode 4, are arranged on a piezoelectric substrate 1 and a protective film 2 is formed on the excitation electrode 4 and at the outer circumferential part of the pad electrode 5 thus producing a surface acoustic wave device.
申请公布号 JP2002261571(A) 申请公布日期 2002.09.13
申请号 JP20010052396 申请日期 2001.02.27
申请人 KYOCERA CORP 发明人 MATSUDA TOSHIYA;KISHU ATSUO
分类号 H03H9/145;H03H3/08;(IPC1-7):H03H9/145 主分类号 H03H9/145
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