| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of mounting a semiconductor element, by which the semiconductor element is fixed surely to a heat sink. SOLUTION: The structure is composed of a mounting bracket 5, in which through-holes 4a, 4b are formed, which comprises contact leg parts 5a, 5b and whose cross section is U-shaped, a radiation fin 1, a board 6, bolts 8a and nuts 8b. A plurality of springs 3a, 3b, 3c whose contact parts are flat are cut and erected on the same face so as to be installed at the mounting bracket 5. Mounting pins 4, in a lock pin shape, used to fix the mounting bracket 5 are erected and installed at the radiation fin 1. The mounting pins 4 are installed, so as to pass the through-holes 4a, 4b via a plurality of semiconductor elements 2a, 2b, 2c and the springs. The mounting pins 4 are made to agree with the through-holes 4a, 4b, and the mounting pins 4 are inserted into the through-holes 4a, 4b in such a way that the plurality of springs 3a, 3b and 3c face the plurality of semiconductor elements 2a, 2b and 2c.
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