| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition which little thins films, does not collapse formed patterns, has characteristics free from the residues (scum) of the photosensitive resin composition at exposed portions, and has high sensitivity, high resolution, and excellent cured film physical properties. <P>SOLUTION: This positive type photosensitive resin composition comprises a polyamideimide resin (A) and a compound (B) generating an acid with light. Herein, the compound (B) generating the acid with light is preferably an ester compound of a phenol compound with 1,2-naphthoquinone-2-diazido-5-sulfonic acid or 1,2-naphthoquinone-2-diazido-4-sulfonic acid. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
