BACKLIGHT UNIT

摘要

PROBLEM TO BE SOLVED: To provide a backlight unit capable of smoothly dissipating a large amount of heat generated from an LED chip being a light source while using a low-cost insulating substrate for a substrate.

SOLUTION: This backlight includes: the insulating substrate 110 with predetermined circuit patterns 111 formed thereon; a plurality of LED packages 130 electrically connected to the circuit patterns 111; an upper heat dissipation plate 114 formed to contact the circuit patterns 111 for dissipating heat generated from the LED packages 130; and a lower heat dissipation plate 116 for transmitting the heat transmitted by the upper heat dissipation plate 114 to a chassis 150. The backlight unit is characterized in that the upper heat dissipation plate 114 and the lower heat dissipating plate 116 are connected to each other by through holes 115 penetrating the insulating substrate 110 with the inside walls plated, and the through-holes 115 and the upper heat dissipation plate 114 are each formed to have a predetermined area ratio.

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