MULTILAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD OF MANUFACTURE

摘要

A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric ( 14 ), patterned conductive surfaces ( 12 and 16 ) on opposing sides of the core dielectric, and at least one hole ( 18 ) in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole ( 19 ). The assembly further includes a processed adhesive layer ( 48 ) between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap ( 67 & 66 ) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of preprocessed substrates.