A method and apparatus for a modular processing system is described. The apparatus includes a transfer chamber as the foundation for the system and includes sidewalls adapted to receive at least three 200 mm and/or 300 mm process chambers. The transfer chamber includes a robot capable of withstanding high temperatures and is configured to transfer 200 mm and 300 mm substrates. The modularity of the transfer chamber is highly transportable and provides a research and development platform at a low cost of ownership and may be modularly built into a production system as additional chambers and peripheral hardware is added.
申请公布号
WO2008024580(A2)
申请公布日期
2008.02.28
申请号
WO2007US74128
申请日期
2007.07.23
申请人
APPLIED MATERIALS, INC.;MYO, NYI OO;POPPE, STEVEN;WHITE, ANTHONY;KRISHNA, NETY M.
发明人
MYO, NYI OO;POPPE, STEVEN;WHITE, ANTHONY;KRISHNA, NETY M.