发明名称 |
Electronic Component Cover and Arrangement |
摘要 |
An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
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申请公布号 |
US2008318446(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20070768166 |
申请日期 |
2007.06.25 |
申请人 |
CLANCY KEVIN;KRAYN KEN;HERTLEIN ROBERT |
发明人 |
CLANCY KEVIN;KRAYN KEN;HERTLEIN ROBERT |
分类号 |
H01R12/00;H01R13/44 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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