FILM CIRCUIT CONNECTING MATERIAL, FILM CIRCUIT CONNECTING MATERIAL, AND CONNECTING STRUCTURE FOR CIRCUIT MEMBER

摘要

Disclosed is an adhesive composition containing a thermoplastic resin, a radically polymerizable compound, a radical polymerization initiator and a radical polymerization modifier. The adhesive composition can be cured sufficiently quickly at low temperatures while exhibiting sufficiently stable adhesion strength, and has a wide process margin for curing. Also disclosed are a circuit connecting material, a connecting structure for circuit members and a semiconductor device.