Vertical LED chip package on TSV carrier

摘要

A light-emitting device (LED) package component includes a carrier wafer. The carrier wafer includes a first through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. A light-emitting device (LED) is bonded onto the carrier wafer. The LED are electrically connected to the first TSV. A conductive thermal interface material (TIM) is located between, and adjoining, the first TSV and the LED.

主权项

1. A light-emitting device (LED) package component, comprising:
a carrier substrate; a plurality of through-substrate vias (TSVs) extending through the carrier substrate from a first surface of the carrier substrate to a second surface of the carrier substrate, the TSVs including a first TSV and a plurality of second TSVs; a light-emitting device (LED), having a first side and a second side opposite to the first side of the LED, bonded to the first surface of the carrier wafer through the first side of the LED; and a conductive thermal interface material (TIM) disposed between the LED and the first surface of the carrier wafer, wherein the first TSV is coupled to the second side of the LED, and the TIM is disposed between the first side of the LED and the plurality of second TSVs.