| 发明名称 | Lithography process and composition with de-crosslinkable crosslink material | ||
| 摘要 | The present disclosure provides a method that includes forming a polymeric material layer on a substrate, wherein the polymeric material layer includes de-crosslinkable crosslink material (DCM); performing a first baking process having a first baking temperature to the polymeric material layer, thereby initiating crosslinking function of the DCM; and performing a second baking process having a second baking temperature to the polymeric material layer, thereby initiating de-crosslinking function of the DCM. | ||
| 申请公布号 | US9362120(B2) | 申请公布日期 | 2016.06.07 |
| 申请号 | US201414537347 | 申请日期 | 2014.11.10 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Su Yu-Chung |
| 分类号 | G03F7/004;H01L21/027;G03F7/40;G03F7/16;G03F7/09 | 主分类号 | G03F7/004 |
| 代理机构 | Haynes and Boone, LLP | 代理人 | Haynes and Boone, LLP |
| 主权项 | 1. A method, comprising: forming a polymeric material layer on a substrate, wherein the polymeric material layer includes de-crosslinkable crosslink material (DCM); performing a first baking process having a first baking temperature to the polymeric material layer, thereby initiating crosslinking function of the DCM; and performing a second baking process having a second baking temperature to the polymeric material layer, thereby initiating de-crosslinking function of the DCM, wherein the second baking temperature is greater than the first baking temperature. | ||
| 地址 | Hsin-Chu TW | ||