| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method capable of flowing uniform current to a substrate.SOLUTION: The plating method is configured so that: in a state that, plural first intermediate contact points 48 and plural second intermediate contact points 49 are brought into contact, a resistance measurement tool 65 is brought into contact with plural external contact points 42 for measuring electric resistance between the plural external contact points 42; a conductor block 60 is inserted into between the plural first intermediate contact points 48 and the plural second intermediate contact points 49; the conductor block 60 is brought into contact with the plural first intermediate contact points 48 and the plural second intermediate contact points 49 for electrically connecting the plural first intermediate contact points 48 and the plural second intermediate contact points 49 via the conductor block 60; the plural external contact points 42 are brought into contact with a power feeding terminal 51; a substrate W is immersed in a plating liquid; then, voltage is applied between an anode 2 disposed in the plating liquid and the substrate W for plating the substrate W.SELECTED DRAWING: Figure 7 |
