发明名称 PRE-PROCESSING METHOD FOR ABRASIVE PAD OF CHEMICAL- MECHANICAL POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a pre-processing method for an abrasive pad, which reduces a time until a prescribed polishing speed is obtained and stabilized when a new pad is mounted, that is a time required for break-in process, resulting in the increased operating rate of a chemical-mechanical polishing device. SOLUTION: The abrasive pad for a chemical-mechanical polishing process is pre-processed by soaking in a hydrophilic processing fluid for a prescribed time before it is mounted onto the chemical-mechanical polishing device.
申请公布号 JP2002254295(A) 申请公布日期 2002.09.10
申请号 JP20010054326 申请日期 2001.02.28
申请人 KAWASAKI MICROELECTRONICS KK 发明人 TAKENAKA YASUHIRO;TAKEDA KAZUO
分类号 B24B53/017;H01L21/304 主分类号 B24B53/017
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