EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION COMPRISING SAME, CURED PRODUCT MADE THEREFROM, AND USE THEREOF

摘要

The present invention relates to an alkoxysilyl-based epoxy compound which exhibits excellent heat resistance characteristics, more particularly, a low coefficient of thermal expansion (CTE) and a high glass transition temperature in a composite, and/or which exhibits excellent flame retardancy in a cured product, and which eliminates the necessity of a separate silane coupling agent. The present invention also relates to a method for preparing the compound, and to a composition and cured product comprising the compound. According to the present invention, provided are: an alkoxysilyl-based epoxy compound having at least one alkoxysilyl group and at least two epoxy groups; a method for preparing the alkoxysilyl-based epoxy compound by means of the ring-opening of the epoxy of a starting material and alkoxysilylation; an epoxy composition comprising the epoxy compound; and a cured product made therefrom and the use thereof. The efficiency of the chemical bonding of the cured product, which is a composite of the composition comprising a novel alkoxysilyl-based epoxy compound according to the present invention, is improved when a composite is formed not only by chemical bonding between an alkoxysilyl group of the epoxy compound and a filler, but also by chemical bonding between alkoxysilyl groups of the epoxy compound having the alkoxysilyl groups. Accordingly, the compound of the present invention exhibits excellent heat resistance characteristics, such as a low CTE and a high glass transition temperature in a composite, and/or exhibits excellent flame retardancy in a cured product.