发明名称 SUBSTRATE LIQUID PROCESSING APPARATUS, LIQUID REMOVAL METHOD, AND RECORDING MEDIUM
摘要 PROBLEM TO BE SOLVED: To remove a liquid adhering to an outer surface of a liquid supply member, such as a nozzle, without scattering the liquid.SOLUTION: A substrate liquid processing apparatus includes: a substrate holding part (33) which holds a substrate to which liquid processing is performed; a liquid supply member (41) which supplies a liquid at a position above the substrate held by the substrate holding part; an electrification member (200) which generates electric charges; and a drive mechanism which moves the liquid supply member and the electrification member relative to each other at a position where the electric charges act on the liquid supply member.SELECTED DRAWING: Figure 2
申请公布号 JP2016136590(A) 申请公布日期 2016.07.28
申请号 JP20150011478 申请日期 2015.01.23
申请人 TOKYO ELECTRON LTD 发明人 NISHIMURA HIDEKI
分类号 H01L21/304 主分类号 H01L21/304
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