| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module capable of improving the life duration and cooling performance without increasing the thickness of an insulating resin sheet.SOLUTION: A semiconductor module comprises: one or a plurality of semiconductor elements constituting at least one arm of one phase of an inverter; a first conductor 2 having a bonded surface 2c bonded to positive-side electrodes of the semiconductor elements, an outside surface 2d facing the bonded surface, and a bottom surface 2a and a top surface 2b crossing the bonded surface and the outside surface; a second conductor 3 having a bonded surface 3c bonded to negative-side electrodes of the semiconductor elements, an outside surface 3d facing the bonded surface, and a bottom surface 3a and a top surface 3b crossing the bonded surface and the outside surface; and a cooler 5 bonded to the bottom surfaces of the first and second conductors via an insulating resin sheet 4. The first and second conductors each have a cutout 6 provided at least the outside surface and located near the bottom surface. |
