发明名称 |
Liquid ejection head and manufacturing method for the same |
摘要 |
A manufacturing method for a liquid ejection head including: a substrate; an ejection orifice forming member having an ejection orifice on the substrate; and a surface layer having a recess that has a bottom portion communicating with the ejection orifice and an opening held in contact with an outside and having a width larger than a width of the ejection orifice, the surface layer being formed on the forming member, the method including: forming a first resin layer serving as the forming member by applying a negative photosensitive resin composition A onto the substrate; forming a second resin layer as the surface layer by applying a negative photosensitive resin composition B having sensitivity lower than sensitivity of the composition A onto the first resin layer; subjecting the first and the second resin layers to pattern exposure collectively; and subjecting the first and the second resin layers to development collectively. |
申请公布号 |
US9427892(B2) |
申请公布日期 |
2016.08.30 |
申请号 |
US201514641702 |
申请日期 |
2015.03.09 |
申请人 |
Canon Kabushiki Kaisha |
发明人 |
Ishii Miho;Ikegame Ken |
分类号 |
B41J2/14;B41J2/16;B29C33/00;G03F7/00 |
主分类号 |
B41J2/14 |
代理机构 |
Fitzpatrick, Cella, Harper & Scinto |
代理人 |
Fitzpatrick, Cella, Harper & Scinto |
主权项 |
1. A manufacturing method for a liquid ejection head, the liquid ejection head comprising:
a substrate; an ejection orifice forming member having an ejection orifice configured to eject a liquid, the ejection orifice forming member being formed on a surface of the substrate; and a surface layer having a recess that has a bottom portion communicating with the ejection orifice and an opening held in contact with an outside and having a width larger than a width of the ejection orifice, the surface layer being formed on the ejection orifice forming member, the manufacturing method comprising: forming a first resin layer serving as the ejection orifice forming member by applying a negative photosensitive resin composition A onto the surface of the substrate; forming a second resin layer serving as the surface layer by applying a negative photosensitive resin composition B having sensitivity lower than sensitivity of the negative photosensitive resin composition A onto the first resin layer; subjecting the first resin layer and the second resin layer to pattern exposure collectively; and subjecting the first resin layer and the second resin layer to development treatment collectively after the pattern exposure, thereby forming the recess in the second resin layer, the recess having a side surface inclined with respect to a direction perpendicular to the surface of the substrate. |
地址 |
Tokyo JP |