发明名称 |
POLISHING COMPOSITION CONTAINING CERIA ABRASIVE |
摘要 |
The invention provides a chemical-mechanical polishing composition including first abrasive particles, wherein the first abrasive particles are wet-process ceria particles, have a median particle size of about 40 nm to about 100 nm, are present in the polishing composition at a concentration of about 0.005 wt.% to about 2 wt.%, and have a particle size distribution of at least about 300 nm, a functionalized heterocycle, a pH-adjusting agent, and an aqueous carrier, and wherein the pH of the polishing composition is about 1 to about 6. The invention also provides a method of polishing a substrate, especially a substrate comprising a silicon oxide layer, with the polishing composition. |
申请公布号 |
WO2016140968(A1) |
申请公布日期 |
2016.09.09 |
申请号 |
WO2016US20261 |
申请日期 |
2016.03.01 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
REISS, Brian;SAUTER VAN NESS, Dana;LAM, Viet;HAINS, Alexander;KRAFT, Steven;JIA, Renhe |
分类号 |
C09K3/14;H01L21/304;H01L21/306 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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