| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device for preventing an increase in parasitic grounding inductance of a high-frequency circuit on a semiconductor substrate wired with a coplanar line. SOLUTION: The circuit device includes a semiconductor substrate 101 having a coplanar line on the front face and a metal on the rear face, and a mounting board 110 on which the semiconductor substrate 101 is mounted in a flip-chip state. In the semiconductor substrate 101, a signal bump connecting conductor 104 wider than a signal conductor 102 is connected to the signal conductor 102. A signal electrode 105 is formed on the signal bump connecting conductor 104, and each grounding bump connecting conductor 16 connected to a grounding conductor 103 of the coplanar line is formed with a prescribed space in between on both sides of an extending line of the signal conductor 102 and on both sides of the signal bump connecting conductor 104. In addition, a first grounding bump electrode 107 is formed at the grounding bump connecting conductor 106, and a second grounding electrode 108 is formed on the grounding conductor 103. |
