| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing head that can increase the degree of planarization on a wafer surface after a wafer is polished, and at the same time can prevent damage in a semiconductor wafer or a head body, and to provide a polishing apparatus using the polishing head. SOLUTION: The polishing head (an upper surface plate 1) has the head body 4 having a recess 4a for retaining a semiconductor wafer W inside, and a membrane 5 for forming pressure space 6 in the recess 4a mounted to the head body 4 and for pressure-welding the semiconductor wafer W onto polishing cloth 56. In this case, the membrane 5 is formed by an elastic material having a wafer press surface 5a that closely comes into contact with an entire surface to be pressed while the wafer is being polished, and at the same time is parallel with a polishing surface 56a of the polishing cloth 56, and a projection 7 for positioning the semiconductor wafer W in a wafer diametric direction is provided on the wafer press surface 5a of the membrane 5. |
