| 发明名称 |
THERMO-ENCAPSULATING SYSTEM AND METHOD |
| 摘要 |
A system and method for cutting and heat sealing polypropylene film and/or other separator material around individually shaped cathode, anode or other active components, for use in a battery or capacitor and/or other implantable medical device. |
| 申请公布号 |
CA2358657(A1) |
申请公布日期 |
2002.09.16 |
| 申请号 |
CA20012358657 |
申请日期 |
2001.10.12 |
| 申请人 |
WILSON GREATBATCH LTD. |
发明人 |
KONOPA, RAYMOND S.;MILLER, ROBERT D. |
| 分类号 |
B23K26/00;B23K26/40;B29C65/00;B29C65/74;B29C65/78;B29L31/34;H01M2/14;H01M2/18 |
主分类号 |
B23K26/00 |
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