| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device wherein ultrasonic welding is used, while packages are sealed easily an properly with underfill resin, proper fillet shape is accomplished, and reliable flip-chip packages are obtained. SOLUTION: The manufacturing method for a semiconductor device has a first process, in which an underfill resin layer (16) is formed on a circuit board 10, so that a wiring pattern 12 is covered therewith; a second process, in which a semiconductor chip 20 having projected electrodes 24 is opposed to the wiring pattern 12 on the circuit board 10, and the projected electrodes 24 are pressed against the wiring pattern 12 penetrated through the underfill resin layer (16) and further ultrasonic vibration is applied to the semiconductor chip 20 to mutually bond the wiring pattern 12 and the projected electrodes 24 together; and a third process, in which the underfill resin layer 16 present between the circuit board 10 and the semiconductor chip 20 is cured. |
