发明名称
摘要 PROBLEM TO BE SOLVED: To enhance the brightness of a light emitting diode by entirely resin sealing an emission element including a cup where an emission chip is coated with a wavelength conversion material thereby condensing a converted light well at first when the emission chip is subjected to wavelength conversion. SOLUTION: An emission element comprising an emission chip 1 of a compound semiconductor mounted on a lead frame 2 having a cup 3 is resin sealed entirely. More specifically, the cup 3 is filled with a first resin 11 and then entirely sealed with a second resin 12 for sealing the emission element entirely. The first resin 11 filling the cup contains a material 5 for converting the emission wavelength of the emission chip into another wavelength or converting the wavelength while absorbing partially. Any fluorescent material, including fluorescent dye, fluorescent pigment and phosphor, may be employed as the wavelength conversion material 5 so long as the material can convert the emission wavelength of the emission chip into another wavelength.
申请公布号 JP3327170(B2) 申请公布日期 2002.09.24
申请号 JP19970143158 申请日期 1997.05.17
申请人 发明人
分类号 H01L23/28;G09F9/00;H01L21/56;H01L23/29;H01L23/31;H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L23/28
代理机构 代理人
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