| 摘要 |
A plasma enhanced chemical vapour deposition device for coating large three-dimensional substrates is provided. The device includes elongated metal rod cathodes 20 each having an aperture 30 at one end that is in communication with a process gas source, with the aperture extending substantially the length of the rod to form a substantially cylindrical bore within the rod, wherein the bore is in communication with the rod exterior through a series of holes 26 in the rod 20, and wherein the diameter of the holes is substantially less than the bore diameter so that the gas pressure is substantially uniform throughout the bore during the deposition process. The rod cathodes, which are situated within an evacuable coating chamber, are arranged in a readily expandable matrix into which substrates 29 to be coated are positioned. <IMAGE> |
