PUTTY BONDING METHOD,申请号JP19920114146-传众专利搜索

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发明名称	PUTTY BONDING METHOD
摘要
申请公布号	JPH05285442(A)	申请公布日期	1993.11.02
申请号	JP19920114146	申请日期	1992.04.06
申请人	YASKAWA ELECTRIC CORP	发明人	YAMADA SEIJI
分类号	B05D1/26;B05D7/00;B05D7/24;(IPC1-7):B05D1/26	主分类号	B05D1/26
代理机构		代理人
主权项
地址

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