发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To provide a wire bonding method by which a wire can be welded properly and securely on the surface of electrodes for bonding even when the electrodes made of metal having high flatness on the surface thereof is used. CONSTITUTION:A pressing punch 10 is successively brought into contact with respective surfaces of electrodes 6 arranged on an electrode forming part in order to form recessed parts on the surface of the electrodes 6, and then a wire 7 passing through a capillary 12 is successively pressed on the surfaces of the electrodes 6 and the wire 7 is welded and bonded on the electrodes 6 through ultrasonic vibration.
申请公布号 JPH0685013(A) 申请公布日期 1994.03.25
申请号 JP19920236986 申请日期 1992.09.04
申请人 CASIO COMPUT CO LTD 发明人 TSUJI MAKI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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