| 摘要 |
PURPOSE:To enable stabilized wire bonding and make easier the exchange work by preventing adhesion of dust to be deposited on a metal fine lead wound around a wire spool and contact by a worker during manipulation. CONSTITUTION:In a wire bonding apparatus for conducting the bonding using a metal fine lead 1 wound around a wire spool 2, a container 3 for storing the metal fine lead 1 and a wire spool 2 is comprised and the container 3 can be replaced under the condition as storing the metal fine lead and wire spool. |
