| 摘要 |
PURPOSE:To easily realize high density packing of an electronic apparatus utilizing a semiconductor chip. CONSTITUTION:The wire bonding pads are arranged in three lines along the side edge 4a of a semiconductor chip 4 through repetition of the arrangement that the first and third pads are provided in the first line, the second pad in the second line and the fourth pad in the third line, with the continuous four wire bonding pads 2a, 2b, 2c on a substrate 1 formed as a pair. Thereby, the minimum interval between the adjacent circuits can be made wider to lower the generation rate of short-circuit of wiring in the wire bonding process and to reduce the man-hours and improve the yield. Moreover, such arrangement can respond to further high density packing and higher precision of electronic apparatus utilizing a semiconductor chip. |
