发明名称 Modified reaction chamber and improved gas flushing method in rapid thermal processing apparatus
摘要 A reaction chamber for a Rapid Thermal Processing (RTP) system contains an aperture to allow introduction and removal of the object to be processed. The cross sectional area of the aperture is significantly less than the cross sectional area of the reaction chamber. A method of flushing the reaction chamber, using a short time laminar flow of the flush gas, is used in combination with the aperture to increase the throughput of the RTP system.
申请公布号 US5580830(A) 申请公布日期 1996.12.03
申请号 US19950387220 申请日期 1995.02.13
申请人 AST ELEKRONIK 发明人 NENYEI, ZSOLT;MERKLE, HELMUT;TILLMANN, ANDREAS
分类号 C23C16/44;(IPC1-7):H01L71/324 主分类号 C23C16/44
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