PACKAGING DEVICE FOR SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a packaging device which can package a semiconductor element at a high yield and a low cost. SOLUTION: The individual field-effect transistor(FET) dies 55 of a packaging device for the dies 55 are eutectically joined to individual FET fitting bars 61 and the combinations of the bars 61 and dies 55 are eutectically joined to the base section 51 of a package 50 together with other elements constituting the package 50. After a wiring process, the package 50 is completed by tightly covering up the package 50 with a cover. The cost of the package 50 is sufficiently reduced from that of well known FET packages, because the number of parts used in the package 50 is extremely smaller than that of the FET packages and micro-voids between the FET dies 55 and fitting bars 61 can be modified economically.