发明名称 COOLING DEVICE FOR HOT DIP ZINC-ALUMINUM ALLOY PLATED WIRE
摘要 PROBLEM TO BE SOLVED: To produce a plated wire of high quality free from the generation of the ruggedness of a plating surface layer and unevenness in thickness in a method for cooling metallic wire plated in a hot dip zinc-aluminum alloy plating bath while being vertically taken up. SOLUTION: In this cooling device, a nozzle 12 jetting compressed air is arranged in the space between an outer cylinder 8 and an inner cylinder 9, and to the nozzle 12 compressed air is supplied, and, by the jet flow of the compressed air, the surrounding air is sucked from the inside of the inner cylinder 9 of the nozzle 12 and from the clearance between the outer cylinder 8 and the nozzle 12 parallel to the axis line of metallic wire 6, also all around the periphery and in the direction the same as the direction to which the metallic wire 6 progresses, thereby, the all periphery of the plating surface layer of the metallic wire 6 is continuously and uniformly solidified, and, after that, water cooling is executed.
申请公布号 JP2000045056(A) 申请公布日期 2000.02.15
申请号 JP19980212371 申请日期 1998.07.28
申请人 HOKKAI KOKI KK 发明人 TAKAHASHI HIDEO;KATAGIRI TATSUO;SUZUKI ISAO;TOMIMURO TAKASHI
分类号 C23C2/06;C23C2/12;C23C2/38;(IPC1-7):C23C2/06 主分类号 C23C2/06
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