| 摘要 |
A semiconductor device has a device isolation oxide film, an interlayer insulating film, hydrogen barrier films, a lower electrode, a capacitor insulating film, an upper electrode, an interlayer insulating film and a wiring layer, formed on a silicon substrate. A gate electrode is formed on a gate oxide film between impurity diffusion regions in the silicon substrate. Further, a capacitor portion, comprising the lower electrode, the capacitor insulating film (ferroelectric or high dielectric substance) and the upper electrode, is completely covered with the hydrogen barrier films. The hydrogen barrier films prevent deterioration of the ferroelectric substance and the high dielectric constant material due to reducing conditions in a hydrogen atmosphere. Other device characteristics, however, are not adversely affected because only the capacitor portion is completely covered with the hydrogen barrier films.
|
