| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure for a micro lead frame plastic (MLP) package the grounding of which are continuous at a high frequency. <P>SOLUTION: The connection structure for an MLP package (20) has a paddle (28) configured so as to be connected to a circuit substrate (24) and a first grounding pad (26) and a second grounding pad (26) connected to the paddle (28), respectively. Both the first grounding pad (26) and the second grounding pad (26) are configured so as to provide grounding continuity between a chip (40) mounted on the paddle (28) and the circuit substrate (24). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
