MATERIAL FOR INSULATION FILM, COATING VARNISH FOR INSULATING FILM AND INSULATING FILM USING THEM, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which has high heat resistance and low dielectric constant after heat treatment, and a semiconductor device using it. SOLUTION: The resin composition comprises a compound which is obtained by reacting a compound having a structure expressed by a general formula (1), and a dissolution accelerating compound which reacts with hydroxyl group in the former compound as a film formation element. In the general formula (1), Ar shows a group or an aromatic group having a polycyclic structure and the reference symbol (a) shows 0 or 1. R11is an organic group with hydrogen number or carbon number over 1. When (q) is an integer of 0 or more and is 2 or more, they can be the same or different. One or more of R1to R5and R6to R10is a bonded portion with Ar, and one or more thereof is hydroxyl group, and others show any of hydrogen, a group with alicyclic structure, organic group and carboxyl group of 1 or more and 10 or less carbon numbers. One or more of R11, R1to R5and R6to R10show a group which has an alicyclic structure. X shows any of -O-, -NHCO-, -CONH-, -COO- and -OCO-. COPYRIGHT: (C)2007,JPO&INPIT