SOLDERING METHOD AND APPARATUS FOR MOUNTING COMPONENT ON PRINTED WIRING BOARD

摘要

When a component is soldered to a printed wiring board (45) for mounting, the printed wiring board to which the component is soldered is heated in a high-oxygen-concentration oxygen atmosphere for forming oxide films (31-39) on the surface of joined portions (109, 111-114). Consequently, the component soldered to the surface of the printed wiring board is prevented from dropping, displacement or lifting from the printed wiring board during reflow of the printed wiring board.