| 摘要 |
A circuit board according to the invention includes a glass substrate, an insulating layer, a plurality of protrusions and a first circuit layer. The insulating layer is disposed on the substrate and has a plurality of protrusion-positioning regions. The protrusion-positioning region is an opening or a concave. Each of the protrusions includes a polymer or a resin material and is disposed in the protrusion-positioning region and surrounded by the insulating layer. The first circuit layer is disposed on the insulating layer and has at least one trace line extending directly onto the protrusion.
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