| 摘要 |
PROBLEM TO BE SOLVED: To reduce the mounting space of a semiconductor device onto a system apparatus, and to increase the capacitance of the semiconductor device. SOLUTION: The semiconductor-device stacked structure is provided with a plurality of semiconductor modules, which comprises a substrate and which comprise at least one each of the semiconductor device mounted on the substrate, a stacking means which stacks the plurality of semiconductor modules and a surface mounting means by which the plurality of semiconductor modules stacked by the stacking means are surface-mounted on a board for the system apparatus. |
