发明名称 FIELD EMISSION DEVICE ARRAY SUBSTRATE AND FABRICATING METHOD THEREOF
摘要 A fabricating method of a field emission device array substrate is provided, which includes the following steps. First, a substrate is provided. Then, a cathode conductive layer is formed on the substrate. Moreover, an anodized layer with a plurality of holes is formed on the cathode conductive layer. Thereafter, a plurality of electron emitters is formed within the holes respectively. Additionally, an insulation layer is formed to cover the electron emitters and the anodized layer. Then, a gate material layer is formed on the insulation layer. Thereafter, the gate material layer is patterned to form a gate layer. The gate layer and the insulation layer have an opening to expose the electron emitters.
申请公布号 US2009009053(A1) 申请公布日期 2009.01.08
申请号 US20070954245 申请日期 2007.12.12
申请人 CHUNGHWA PICTURE TUBES, LTD. 发明人 LIN CHEN-CHUN;PAN FU-MING;CHANG KAI-CHUN;KUO CHUAN-WEN;LIU MEI;MO CHI-NENG
分类号 H01J1/62;H01J9/02 主分类号 H01J1/62
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