Antenna structure for integrated circuit die using bond wire

摘要

A device 20 includes a substrate 22 having an integrated circuit (IC) die 24 coupled thereto. A bond wire 28 interconnects a die bond pad 32 on the IC die 24 with an insulated bond pad 36. Another bond wire 38 interconnects a die bond pad 42 on the IC die 24 with another insulated bond pad 46. The bond wires 28 and 38 serve as radiating elements of a dipole antenna structure 64. A reflector 72 and director 74 can be located on the substrate 22 and/or the IC die 24 to reflect and/or direct a radiation pattern 66 emitted by or received by the antenna structure 64. A trace 82 can be interconnected between the insulated bond pads 36, 46 to form a folded dipole antenna structure 84.