发明名称 HEAT-RESISTANT IC TAG AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an inner structure of a glass vessel capable of preventing an external impact from changing a location inside the glass vessel of a glass fiber heat insulator packed in order to protect an IC tag from heat, in the heat-resistant tag accommodating an IC tag inlet inside the glass vessel.SOLUTION: In a heat-resistant IC tag, an IC tag 10 is accommodated inside an airtight glass vessel 2 and a gap is filled with a glass fiber heat insulator 3. The glass vessel 2 includes a fixing layer 5 in which glass fine powder is fixed at a prescribed thickness, at an upper inner wall portion descending from a shoulder R32. The prescribed thickness is within a range from 3 mm to 1 mm.SELECTED DRAWING: Figure 4
申请公布号 JP2016091156(A) 申请公布日期 2016.05.23
申请号 JP20140222444 申请日期 2014.10.31
申请人 TOPPAN PRINTING CO LTD 发明人 NAKAGAWA KIMIKATSU;KOBAYASHI MAIKO
分类号 G06K19/077 主分类号 G06K19/077
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