发明名称 |
Disc comprising an electrical connection element |
摘要 |
A pane with an electrical connection element is described. The pane can have a glass substrate and an electrically conductive structure on the substrate. Solder material can be used to electrically connect a connection element to the electrically conductive structure. |
申请公布号 |
US9385437(B2) |
申请公布日期 |
2016.07.05 |
申请号 |
US201113695426 |
申请日期 |
2011.07.04 |
申请人 |
SAINT-GOBAIN GLASS FRANCE |
发明人 |
Cholewa Harald;Schlarb Andreas;Lesmeister Lothar;Rateiczak Mitja;Reul Bernhard;Schmidt Lothar |
分类号 |
H01R4/02;H01R43/20;B23K1/002;B23K35/36;H01R43/16;B23K1/06;H05B3/84;B23K35/26;H05K3/34 |
主分类号 |
H01R4/02 |
代理机构 |
Steinfl & Bruno LLP |
代理人 |
Steinfl & Bruno LLP |
主权项 |
1. A pane comprising:
a glass substrate having a first coefficient of thermal expansion; an electrically conductive structure having a layer thickness of 5 μm to 40 μm on a region of the glass substrate; a connection element having a second coefficient of thermal expansion, wherein the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is higher than 5×10−6/° C.; a layer of a lead-free solder material electrically connecting the connection element to a portion of the electrically conductive structure, wherein the connection element contains at least 55 wt.-% to 70 wt.-% iron, 30 wt.-% to 45 wt.-% nickel, 0 wt.-% to 5 wt.-% cobalt, 0 wt.-% to 1 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, or 0 wt.-% to 1 wt.-% carbon, wherein the connection element is connected to the portion of the electrically conductive structure via a contact surface over an entire surface of the connection element, and wherein the contact surface has no corners. |
地址 |
Courbevoie FR |