| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer interconnection board that can suppress voids in laminated layers and maintain a uniform thickness of an insulating layer when the multilayer interconnection board has a VB layer and a signal layer, without causing such problems as significant increase in material cost or remaining of an undesired interconnection layer in a product.SOLUTION: The multilayer interconnection board includes: an insulating layer; a plurality of interconnection layers each having an interconnection and deposited in a thickness direction on the insulating layer; a through hole penetrating the insulating layer and the interconnection layers; and a non-through hole penetrating the insulating layer in a region without the interconnections, the interconnection layers having a VG layer with one of a power source interconnection and a ground wiring and a signal layer with a signal wiring, the VG layer having a dummy interconnection in a region corresponding to the non-through hole and the signal layer having no dummy interconnection in a region corresponding to the non-through hole, and the dummy interconnection being electrically independent from the VG layer and the signal layer.SELECTED DRAWING: Figure 1 |
