| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic element mounting board capable of suppressing function deterioration of an electronic element due to dust resulting from an organic wiring board, and to provide an electronic device.SOLUTION: In the plan view, an organic wiring board 6 is provided to surround a metal plate 4 having an electronic element mounting region for mounting an electronic element 10, a ceramic wiring board 2 is constituted like a frame so as to cover the gap of the organic wiring board 6 and metal plate 4, and the periphery of the organic wiring board 6 surrounding the metal plate 4 is covered with the ceramic wiring board 2. A bonding material 15 fills between the upper surface on the periphery of the organic wiring board 6 surrounding the metal plate 4 and the lower surface of the ceramic wiring board 2, fills between the outer periphery of the metal plate 4 and the lower surface of the ceramic wiring board 2, fills the gap of the organic wiring board 6 and the metal plate 4, and bonds the organic wiring board 6 and the metal plate 4 and the ceramic wiring board 2.SELECTED DRAWING: Figure 1 |
