| 摘要 |
PROBLEM TO BE SOLVED: To provide a Ni sputtering target to which sputtering can be stably performed even in the case where sputtering gas pressure is low.SOLUTION: An orientation degree R{220} of a {220} plane, which is calculated in the case where X-ray diffraction intensity from a {111} plane is I{111}, X-ray diffraction intensity from a {200} plane is I{200}, and X-ray diffraction intensity from a {220} plane is I{220} on a sputtering surface, and X-ray diffraction intensity from the {111} plane is I{111}, X-ray diffraction intensity from the {200} plane is I{200}, and X-ray diffraction intensity from the {220} plane is I{220} on a randomly oriented standard sample, is made larger than an orientation degree R{111} of the {111} plane and an orientation degree R{200} of the {200} plane, surface roughness of the sputtering surface is within a range of 1.00 μm or more and 6.30 μm or less at arithmetic average roughness Ra, and an average crystal grain diameter of the sputtering surface is within a range of 50 μm or more and 250 μm or less.SELECTED DRAWING: None |
