| 发明名称 |
POLYARYLENE COMPOSITIONS WITH ENHANCED MODULUS PROFILES |
| 摘要 |
<p>This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300° C. during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.</p> |
| 申请公布号 |
IL149735(D0) |
申请公布日期 |
2002.11.10 |
| 申请号 |
IL20000149735 |
申请日期 |
2000.10.31 |
| 申请人 |
DOW GLOBAL TECHNOLOGIES INC. |
发明人 |
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| 分类号 |
C08G61/00;C08G61/10;C08L65/00;H01L23/532;(IPC1-7):C08G |
主分类号 |
C08G61/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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