| 摘要 |
In a sputtering apparatus comprising a film-deposition chamber having a gas-supplying pipe connected thereto, for depositing a film on the surface of a substrate to be processed, a target provided in the film-deposition chamber, a mask having an opening portion and a masking portion, the mask being provided opposing to the target in the film-deposition chamber, and holding means for holding the substrate against the mask in such a manner that the film-depositing surface of the substrate is in close contact with the mask, the improvement according to the present invention comprises a mask having exhaust passages formed in the masking portion thereof, each of exhaust passages having one end exposed to the inside of the film-deposition chamber and the other end exposed to the outside of the film-deposition chamber, the one end of each of the exhaust passages and the other end thereof being communicated with each other, but not seen through each other.
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