ELECTRODEPOSITION GRINDING MATERIAL

摘要

PROBLEM TO BE SOLVED: To secure the excellent cutting quality while preventing sticking of chips. SOLUTION: An abrasive grain layer 13 on base metal 12 is composed of a metal plating phase 15, and a metallic group composite plating layer 32 for covering the upper surface. In the metallic group composite plating phase 32, a raw material having a friction coefficient smaller than metal is dispersed by a prescribed quantity in the plating metal being the subject.