发明名称 |
Circuit board and process for producing the same |
摘要 |
A circuit board comprising: a core material consisting of any one selected from the group consisting of magnesium, a magnesium alloy, and a magnesium-based composite material; and an electric circuit formed on the core material. A process for producing the circuit board comprises: forming an electrodeposition-painted coating on such a core material; forming a polyimide resin coating on the electrodeposition-painted coating; forming a viahole extending through the resin coating to the underlying electrodeposition-painted coating; etching and removing the electrodeposition-painted coating in the region exposed in the bottom of the viahole while masking the other region with the resin coating, to extend the viahole to the core material; forming a metal film at least on a free surface of the resin coating and a inner surface of the extended viahole; and etching the metal film by using a photoresist mask to form a conductor layer having a predetermined pattern. <IMAGE> |
申请公布号 |
EP0476898(B1) |
申请公布日期 |
1995.12.20 |
申请号 |
EP19910308201 |
申请日期 |
1991.09.09 |
申请人 |
FUJITSU LIMITED |
发明人 |
HORIKOSHI, EIJI;TANI, MOTOAKI;WATANABE, ISAO;NATORI, KATSUHIDE;SATO, TAKEHIKO, GURINHIRU KAMOSHIDANISHI 23-101 |
分类号 |
H05K1/05;H05K3/00;H05K3/44;H05K3/46;H05K5/02;(IPC1-7):H05K1/00;H05K3/28;H05K3/42 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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