| 发明名称 |
METHOD OF PACKAGING SEMICONDUCTOR DEVICE USING ANISOTROPIC CONDUCTIVE ADHESIVE |
| 摘要 |
<p>A circuit board (17) is provided with anisotropic conductive adhesive (13). Projection electrodes (14) provided on a semiconductor device (16) are positioned to wiring patterns (15) on the circuit board (17). The semiconductor device (16) is mounted on the circuit board (17). The semiconductor device (16) is preliminarily attached to the circuit board (17) by a thermocompression tool (18) at lower temperature than the hardening temperature of the adhesive resin (11) of the anisotropic conducting adhesive (13). The semiconductor device (16) is finally bonded to the circuit board (17) by heating the adhesive resin (11) at its hardening temperature.</p> |
| 申请公布号 |
WO0045431(A1) |
申请公布日期 |
2000.08.03 |
| 申请号 |
WO2000JP00420 |
申请日期 |
2000.01.27 |
| 申请人 |
CITIZEN WATCH CO., LTD.;WATANABE, MAKOTO |
发明人 |
WATANABE, MAKOTO |
| 分类号 |
H01L21/60;H05K3/32;H05K3/34;(IPC1-7):H01L21/60;H01L21/311 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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